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NCP605, NCP606 500mA, Low IGND, CMOS LDO Regulator with/without Enable and with Enhanced ESD Protection
The NCP605/NCP606 provide in excess of 500 mA of output current at fixed voltage options or an adjustable output voltage from 5.0 V down to 1.25 V. These devices are designed for space constrained and portable battery powered applications and offer additional features such as high PSRR, low noise operation, short circuit and thermal protection. The devices are designed to be used with low cost ceramic capacitors and are packaged in the DFN6 3x3.3. NCP605 is designed without enable pin, NCP606 is designed with enable pin.
Features http://onsemi.com MARKING DIAGRAM
1 DFN6, 3x3.3 MN SUFFIX CASE 506AX xxxx zzz A Y WW G xxxx zzz AYWWG G
* Output Voltage Options: * * * * * * * * * * * * *
Adjustable, 1.5 V, 1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V, 5.0 V Adjustable Output by External Resistors from 5.0 V down to 1.25 V Current Limit 675 mA Low IGND (Independent of Load) $1.5% Output Voltage Tolerance Over All Operating Conditions (Adjustable) $2% Output Voltage Tolerance Over All Operating Conditions (Fixed) NCP605 Fixed is Direct Replacement LP8345 Typical Noise Voltage of 50 mVrms without a Bypass Capacitor Enhanced ESD Ratings: 4 kV Human Body Mode (HBM) 400 V Machine Model (MM) These are Pb-Free Devices Hard Disk Drivers Notebook Computers Battery Power Electronics Portable Instrumentation
= P605 or P606 = ADJ, 150, 180, 250, 280, 300, 330, 500 = Assembly Location = Year = Work Week = Pb-Free Package
(Note: Microdot may be in either location)
NCP605 PIN CONNECTIONS DFN6 3x3.3mm
Vin GND NC 1 2 3 (TOP VIEW) GND 6 5 4 Vin SENSE/ADJ Vout
Typical Applications
NCP606 PIN CONNECTIONS DFN6 3x3.3mm
Vin Vout Vout Cout (TOP VIEW) GND EN 1 2 3 GND 6 5 4 Vin SENSE/ADJ Vout
Vin Cin
Vin NCP605 (Fixed)
SENSE GND
ORDERING INFORMATION Figure 1. NCP605 Typical Application Circuit for Fixed Version (1.5 V, 1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V, 5.0 V)
See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2008
May, 2008 - Rev. 1
1
Publication Order Number: NCP605/D
NCP605, NCP606
Vin Cin Vin NCP606 (Fixed) EN SENSE GND Vout Cout Vout
Figure 2. NCP606 Typical Application Circuit for Fixed Version (1.5 V, 1.8 V, 2.5 V, 2.8 V, 3.0 V, 3.3 V, 5.0 V)
Vin Cin
Vin
Vout NCP605 (Adjustable) GND ADJ
Vout R1 Cout
Vin Cin
Vin
Vout NCP606 (Adjustable) GND ADJ
Vout Cout
EN
R1
R2
R2
Figure 3. NCP605 Typical Application Circuit for Adjustable Version (1.25 V < Vout v 5.0 V)
Figure 4. NCP606 Typical Application Circuit for Adjustable Version (1.25 V < Vout v 5.0 V)
Vin Cin
Vin
Vout Cout
Vout
Vin Cin
Vin
Vout Cout
Vout
NCP605 (Adjustable) GND ADJ
NCP606 (Adjustable) EN GND ADJ
Figure 5. NCP605 Typical Application Circuit for Adjustable Version (Vout = 1.25 V)
Figure 6. NCP606 Typical Application Circuit for Adjustable Version (Vout = 1.25 V)
Vin Adjustable Version Only Driver with Current Limit Thermal Shutdown + - Vref
Vout
Vin Adjustable Version Only Driver with Current Limit Thermal Shutdown EN + - Vref
Vout
SENSE/ADJ
SENSE/ADJ
GND Fixed Version Only
GND Fixed Version Only
Figure 7. NCP605 Simplified Block Diagram
Figure 8. NCP606 Simplified Block Diagram
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NCP605, NCP606
PIN FUNCTION DESCRIPTION
Pin No. 1 2 3 4 5 Pin Name Vin GND NC/EN Vout SENSE/ADJ Positive Power Supply Input* Power Supply Ground NCP605: This Pin is Not Connected NCP606: This Pin is Enable Input, Active HIGH Regulated Output Voltage Output Voltage Sense Input Fixed Version: Connect Directly to Output Capacitor Adjustable Version: Connect to Middle Point of External Resistor Divider Positive Power Supply Input* Exposed Pad is Connected to Ground Description
6 EPAD
Vin GND
*Pins 1 and 6 must be connected together externally for output current full range operation
ABSOLUTE MAXIMUM RATINGS
Rating Input Voltage Range (Note 1) Chip Enable Voltage Range (NCP606 only) Output Voltage Range Output Voltage/Sense Input Range, SENSE/ADJ ESD Capability Maximum Junction Temperature Storage Temperature Range Human Body Model Machine Model Symbol Vin VEN Vout VADJ ESD TJ(MAX) TSTG Value -0.3 to 6.5 -0.3 to 6.5 -0.3 to 6.5 -0.3 to 6.5 4000 400 150 -65 to 150 Unit V V V V V C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD Protection and exceeds the following tests: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC- 150 mA per JEDEC standard: JESD78Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating: v 150 mA per JEDEC standard: JESD78. 1. Minimum Vin = (Vout + VDO) or 1.5 V, whichever is higher.
THERMAL CHARACTERISTICS
Rating Thermal Resistance, Junction-to-Ambient (Note 2) Thermal Resistance, Junction-to-Case Symbol RqJA RYJC Value 75 18 Unit C/W C/W
2. Soldered on 645 mm2, 1 oz copper area, FR4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
OPERATING RANGES (Note 3)
Rating Input Voltage (Note 4) Output Current (Notes 5 and 6) Junction Temperature Ambient Temperature 3. 4. 5. 6. Symbol Vin Iout TJ TA Value 1.5 to 6.0 0 to 675 -40 to 150 -40 to 125 Unit V mA C C
Refer to Electrical Characteristics and Application Information for Safe Operating Area. Minimum Vin = (Vout + VDO) or 1.5 V, whichever is higher. Minimum limit valid for fixed versions only. For more details refer to Application Information Section. Maximum limit for Vout = Vout(nom) - 10%.
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NCP605, NCP606
ELECTRICAL CHARACTERISTICS
Vin = (Vout + 0.5 V) or 1.5 V, whichever is higher, Cin = 1 mF, Cout = 1 mF, for typical values TA = 25C, for min/max values TA = -40C to 85C; unless otherwise noted. (Notes 9 and 10) Parameter Output voltage (Adjustable Version) Output voltage (Fixed Versions) Test Conditions Vin = 1.75 V to 6 V Iout = 1 mA to 500 mA 1.5 V Vin = (Vout + 0.5 V) to 6 V 1.8 V Iout = 1 mA to 500 mA 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V Vin = (Vout + 0.5 V) to 6 V, Iout = 1 mA Iout = 1 mA to 500 mA VDO = Vin - Vout Vout = 1.25 V Iout = 500 mA VDO = Vin - (Vout - 0.1 V) 1.5 V Iout = 500 mA 1.8 V Vout = 0 V to 90% Vout(nom) 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V VEN = 0 V Iout = 1 mA to 500 mA Vout = Vout(nom) - 10 % Vout = 0 V Symbol Vout Vout Min 1.231 (-1.5%) 1.470 1.764 2.450 2.744 2.940 3.234 4.900 (-2%) - - - Typ 1.250 1.5 1.8 2.5 2.8 3.0 3.3 5.0 4 10 450 Max 1.269 (+1.5%) 1.530 1.836 2.550 2.856 3.060 3.366 5.100 (+2%) 10 30 470 Unit V V
Line regulation Load regulation Dropout voltage (Adjustable Version) (Note 9) Dropout voltage (Fixed Version)
Regline Regload VDO
mV mV mV
VDO
- - - - - - - - - 675 700
290 250 200 190 180 170 150 0.1 145 - 1000
360 300 250 240 230 220 200 1 180 - 1350
mV
Disable Current (NCP606 Only) (Note 10) Ground Current Current Limit (Note 11) Output Short Circuit Current Enable Input Threshold Voltage (NCP606 Only) Voltage Increasing, Logic High Voltage Decreasing, Logic Low Turn-on Time (Note 11)
IDIS IGND ILIM ISC Vth(EN)
mA mA mA mA V
High Low Vin = 0 V to (Vout + 0.5 V) or 1.75 V, 1.25 V whichever is higher 1.5 V Vout = 0 V to 90% of Vout(nom) 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V ton
0.9 - - - - - - - - - - - - - - - - -
- - 6 6 7 8 10 12 15 30 12 12 13 16 18 19 20 30
- 0.4 - - - - - - - - - - - - - - - - ms
Enable Time (NCP606 Only) (Note 11) VEN = From 0 V to Vin 1.25 V 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V
tEN
ms
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 9. Maximum dropout voltage is limited to minimum input voltage Vin = 1.7 V recommended for guaranteed operation at maximum output current. 10. Refer to application information section. 11. Values based on design and/or characterization.
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NCP605, NCP606
ELECTRICAL CHARACTERISTICS
Vin = (Vout + 0.5 V) or 1.5 V, whichever is higher, Cin = 1 mF, Cout = 1 mF, for typical values TA = 25C, for min/max values TA = -40C to 85C; unless otherwise noted. (Notes 9 and 10) Parameter Power Supply Ripple Rejection (Note 11) Test Conditions Iout = 500 mA Vout = 1.25 V Vin - Vout = 1 V f = 120 Hz, 0.5 VPP f = 1 kHz, 0.5 VPP f = 10 kHz, 0.5 VPP f = 10 Hz to 100 kHz, Vout = 1.25 V Symbol PSRR - - - Vn TSD TSH - - - 62 55 40 50 175 10 - - - - - - mVrms C C Min Typ Max Unit dB
Output Noise Voltage (Note 11) Thermal Shutdown Temperature (Note 11) Thermal Shutdown Hysteresis (Note 11)
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 9. Maximum dropout voltage is limited to minimum input voltage Vin = 1.7 V recommended for guaranteed operation at maximum output current. 10. Refer to application information section. 11. Values based on design and/or characterization.
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TYPICAL CHARACTERISTICS
1.269 1.2652 Vout, OUTPUT VOLTAGE (V) 1.2614 1.2576 1.2538 1.25 1.2462 1.2424 1.2386 1.2348 1.231 -40 -20 0 20 40 60 80 100 Vin = Vout + 0.5 V = 1.75 V Vin = 6.0 V Vout = 1.25 V Vout, OUTPUT VOLTAGE (V) 2.55 2.54 2.53 2.52 2.51 2.5 2.49 2.48 2.47 2.46 2.45 -40 -20 0 20 40 60 80 100 Vin = 6.0 V Vin = Vout + 0.5 V = 3.0 V Vout = 2.5 V
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 9. Output Voltage vs. Temperature (Vout = 1.25 V)
5.1 VDO, DROPOUT VOLTAGE (mV) 5.08 Vout, OUTPUT VOLTAGE (V) 5.06 5.04 5.02 5 4.98 4.96 4.94 4.92 4.9 -40 -20 0 20 40 60 80 100 Vin = 6.0 V Vin = Vout + 0.5 V = 5.5 V Vout = 5.0 V 300 270 240 210 180 150 120 90 60 30 0 -40
Figure 10. Output Voltage vs. Temperature (Vout = 2.5 V)
Vout = 2.5 V
Iout = 500 mA
Iout = 300 mA Iout = 150 mA
-20
0
20
40
60
80
100
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 11. Output Voltage vs. Temperature (Vout = 5.0 V)
200 VDO, DROPOUT VOLTAGE (mV) IGND, GROUND CURRENT (mA) 180 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 Iout = 300 mA Iout = 150 mA Iout = 500 mA Vout = 5.0 V 180 170 160 150 140 130 120 110 100 90 80 -40
Figure 12. Dropout Voltage vs. Temperature (Vout = 2.5 V)
Vin = Vout + 0.5 V Iout = 500 mA Vout = 5.0 V
Vout = 2.5 V
Vout = 1.25 V
-20
0
20
40
60
80
10
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 13. Dropout Voltage vs. Temperature (Vout = 5.0 V)
Figure 14. Ground Current vs. Temperature
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TYPICAL CHARACTERISTICS
1200 ISC, SHORT CIRCUIT CURRENT LIMIT (mA) 1160 1120 1080 PSRR (dB) 1040 1000 960 920 880 840 800 -40 -20 0 20 40 60 80 100 Vin = 1.75 V Vin = 6.0 V Vout = 1.25 V 80 70 60 50 40 30 Vout = 1.25 V 20 Vin = 2.25 V Cout = 1.0 mF 10 T = 25C A 0 10 100 1000 f, FREQUENCY (Hz) 10000 100000 Iout = 500 mA Iout = 1mA
TA, AMBIENT TEMPERATURE (C)
Figure 15. Short Circuit Current Limit vs. Temperature (Vout = 1.25 V)
80 70 60 PSRR (dB) 50 40 30 20 10 0 10 Vout = 2.5 V Vin = 3.5 V Cout = 1.0 mF TA = 25C 100 1000 f, FREQUENCY (Hz) 10000 Iout = 500 mA Iout = 1mA 1600 Vn, NOISE DENSITY (nV//HZ) 1400 1200 1000 800 600 400 200 0 10
Figure 16. PSRR vs. Frequency (Vout = 1.25 V)
Vn = 47 mVrms
Vin = Vout + 0.5 V = 1.75 V Cin = Cout = 1.0 mF Iout = 500 mA TA = 25C
100000
100
1000
10000
100000
f, FREQUENCY (Hz)
Figure 17. PSRR vs. Frequency (Vout = 2.5 V)
2500 Vn, NOISE DENSITY (nV//HZ) Vn = 70 mVrms 2000 1500 1000 500 0 10
Iout 500 mA/div
Figure 18. Noise Density vs. Frequency (Vout = 1.25 V)
Vin = Vout + 0.5 V = 3.0 V Cin = Cout = 1.0 mF Iout = 500 mA TA = 25C
Vout 200 mV/div
Vin = 3.0 V Vout = 2.5 V Cout = 10 mF trise = tfall = 1 ms TA = 25C
100
1000 f, FREQUENCY (Hz)
10000
100000 TIME (40 ms/div)
Figure 19. Noise Density vs. Frequency (Vout = 2.5 V)
Figure 20. Load Transient (Vout = 2.5 V)
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TYPICAL CHARACTERISTICS
Vout 100 mV/div
Vout 1 V/div
4.0 V
Vin = 2.5 V Iout = 500 mA Cout = 10 mF trise = tfall = 1 ms TA = 25C
Vin 1 V/div
Vout = 2.5 V Iout = 0 mA Cout = 10 mF
Vin 500 mV/div
3.0 V TIME (20 ms/div)
Vin = 3.0 V trise = 1 ms TA = 25C TIME (10 ms/div)
Figure 21. Line Transient (Vout = 2.5 V)
Figure 22. Startup Transient (Vout = 2.5 V)
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DEFINITIONS
General
All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature.
Line Regulation
current are kept constant during the measurement. Results are expressed in mVrms or nV / Hz.
Turn-on and Turn-off Times
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in output load current at a constant temperature.
Dropout Voltage
Turn-on Time is time difference measured during power-up of the device from the moment when input voltage reaches 90% of its operating value to the moment when output voltage reaches 90% of its nominal value at specific output current or resistive load. Turn-off Time is time difference measured during power-down of the device from the moment when input voltage drops to 10% of its operating value to the moment when output voltage drops to 10% of its nominal value at specific output current or resistive load.
Enable and Disable Times
The input to output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Ground and Disable Currents
Ground Current is the current that flows through the ground pin when the regulator operates without a load on its output (IGND). This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS).
Current Limit and Short Circuit Current Limit
Enable Time is time difference measured during power-up of the device from the moment when enable voltage reaches 90% of input voltage operating value to the moment when output voltage reaches 90% of its nominal value at specific output current or resistive load. Disable Time is time difference measured during power-down of the device from the moment when enable voltage drops to 10% of input voltage operating value to the moment when output voltage drops to 10% of its nominal value at specific output current or resistive load.
Line Transient Response
Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope.
Load Transient Response
Current Limit is value of output current by which output voltage drops by 10% with respect to its nominal value. Short Circuit Current Limit is output current value measured with output of the regulator shorted to ground.
PSRR
Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between no-load and full-load conditions.
Thermal Protection
Power Supply Rejection Ratio is defined as ratio of output voltage and input voltage ripple. It is measured in decibels (dB).
Output Noise Voltage
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
This is the integrated value of the output noise over a specified frequency range. Input voltage and output load
The power dissipation level at which the junction temperature reaches its maximum operating value.
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APPLICATIONS INFORMATION The NCP605/NCP606 regulator is self*protected with internal thermal shutdown and internal current limit. Typical application circuits are shown in Figures 1 to 4.
Input Decoupling (Cin) Noise Decoupling
A ceramic or tantalum 1.0 mF capacitor is recommended and should be connected close to the NCP605/NCP606 package. Higher capacitance and lower ESR will improve the overall line transient response.
The NCP605/NCP606 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCP605/NCP606 operates without a noise reduction capacitor, has a typical 8 ms turn-on time and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz.
Enable Operation (NCP606 Only)
The NCP605/NCP606 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Typical characteristics were measured with Murata ceramic capacitors. GRM219R71E105K (1 mF, 25 V, X7R, 0805) and GRM21BR71A106K (10 mF, 10 V, X7R, 0805).
No-Load Regulation Considerations
Output Decoupling (Cout)
The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn-on/turn-off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to Vin.
Output Voltage Adjust
The NCP605/NCP606 adjustable regulator will operate properly under conditions where the only load current is through the resistor divider that sets the output voltage. However, in the case where the NCP605/NCP606 is configured to provide a 1.250 V output, there is no resistor divider. If the part is enabled under no-load conditions, leakage current through the pass transistor at junction temperatures above 85C can approach several microamps, especially as junction temperature approaches 150C. If this leakage current is not directed into a load, the output voltage will rise up to a level approximately 20 mV above nominal. The NCP605/ NCP606 contains an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to Vin (NCP606 only) will ensure that the part is active whenever the supply voltage is present, thus guaranteeing that the clamp circuit is active whenever leakage current is present. When the NCP606 adjustable regulator is disabled, the overshoot clamp circuit becomes inactive and the pass transistor leakage will charge any capacitance on Vout. If no load is present, the output can charge up to within a few millivolts of Vin. In most applications, the load will present some impedance to Vout such that the output voltage will be inherently clamped at a safe level. A minimum load of 10 mA is recommended. Unlike LP8345, for NCP605/606 fixed voltage versions there is no limitation for minimum load current.
The output voltage can be adjusted from 1 times (Figure 4) to 4 times (Figure 3) the typical 1.250 V regulation voltage via the use of resistors between the output and the ADJ input. The output voltage and resistors are chosen using Equation 1 and Equation 2.
V out + 1.250 1 ) R1 R2 R1
V
) I ADJ
R1
(eq. 1)
R2 ^
out
1.25
*1
(eq. 2)
Input bias current IADJ is typically less than 150 nA. Choose R1 arbitrarily to minimize errors due to the bias current and to minimize noise contribution to the output voltage. Use Equation 2 to find the required value for R2.
Thermal
As power in the NCP605/NCP606 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCP605/NCP606 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCP605/NCP606 can handle is given by:
P D(MAX) + T J(MAX) * T A R QJA (eq. 3)
Since TJ is not recommended to exceed 125C (TJ(MAX)), then the NCP605/NCP606 soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 1.3 W when the ambient
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temperature (TA) is 25C. See Figure 23 for RqJA versus PCB area. The power dissipated by the NCP605/NCP606 can be calculated from the following equations:
P D [ V in I GND@I OUT ) I out V in * V out (eq. 4)
Hints
or
V in(MAX) [ 250 200 RqJA, (C/W) 150 100 50 0 FR4 = 1.0 oz FR4 = 2.0 oz P D(MAX) ) V out I out ) I GND I out (eq. 5)
Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCP605/NCP606, and make traces as short as possible.
0
200
400 COPPER AREA
600 (mm2)
800
Figure 23. Thermal Resistance vs. Copper Area
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ORDERING INFORMATION
Device NCP605MNADJT2G NCP605MN15T2G NCP605MN18T2G NCP605MN25T2G NCP605MN28T2G NCP605MN30T2G NCP605MN33T2G NCP605MN50T2G NCP606MNADJT2G NCP606MN15T2G NCP606MN18T2G NCP606MN25T2G NCP606MN28T2G NCP606MN30T2G NCP606MN33T2G NCP606MN50T2G Nominal Output Voltage (V) ADJ 1.5 1.8 2.5 2.8 3.0 3.3 5.0 ADJ 1.5 1.8 2.5 2.8 3.0 3.3 5.0 Marking P605 ADJ P605 150 P605 180 P605 250 P605 280 P605 300 P605 330 P605 500 P606 ADJ P606 150 P606 180 P606 250 P606 280 P606 300 P606 330 P606 500 Package DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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PACKAGE DIMENSIONS
DFN6 3x3.3 MM, 0.95 PITCH CASE 506AX-01 ISSUE O
DATE 20 JAN 2006
NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN NOM MAX 0.80 --- 0.90 0.00 --- 0.05 0.20 REF 0.30 --- 0.40 3.00 BSC 1.90 --- 2.10 3.30 BSC 1.10 --- 1.30 0.95 BSC 0.20 --- --- 0.40 --- 0.60 0.00 --- 0.15
D
A B
2X
0.15 C
2X
0.15 C 0.10 C
6X
0.08 C SIDE VIEW D2
6X
L
1 3
6X
L1
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CCC CCC CCC CCC
6
PIN 1 REFERENCE
E
TOP VIEW
A (A3) A1
4X
C
SEATING PLANE
SOLDERING FOOTPRINT*
3.60
e
K
1
1.35
0.50
6X
E2 2.15
4 6X
0.95 PITCH
b
(NOTE 3)
BOTTOM VIEW
0.10 C A B 0.05 C
0.83
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
NCP605/D

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